DFI 3rd Generation Intel® Core™ Processor-Based Embedded System Targets Industrial Automation Applications
DFI’s industrial grade EC300 series system features passive cooling and anti-shock drive bay mounting designed for factory floor environments. The unique modular-concept construction supports 12 system configurations using three riser cards and three I/O module options in a cable-free assembly. Virtually unlimited systems configurations are possible using low-cost OEM I/O modules designed to meet custom OEM specification requirements.
The industrial embedded system boasts exceptional speed and high performance with the 3rd generation Intel® Core™ processors. In addition, the system takes full advantage of the Mobile Intel® QM77 Express chipset which is packed with high performance I/O capabilities to provide increased mobile computing and graphics performance. Systems can be configured with up to 16GB DDR3 1333MHz memory, 2 USB 3.0 ports to process more data load, 6 USB 2.0 ports, 10 RS232/422/485 serial ports, 16 GPIO for device controls, and 2 PCIe/PCI expansion slots. A separate mini PCIe x1 slot supports wire-less connectivity using an optional Wi-Fi card and two front mounted antennas.
EC300 is capable of withstanding harsh environments to maintain system reliability in factory floor and other automation computing applications. It is able to work in temperatures ranging from 0 ~ 60°C with anti-shock hard drive mounts, and ruggedized cable-free board assembly to protect against system failure.
This low-power industrial system is ideal for applications requiring a stable revision-controlled platform with flexible system configuration, such as industrial control, factory floor automation, smart grid & power generation, and building automation.8 Elkins Road
East Brunswick, NJ, 08816